| Resistance to Soldering Heat |
Appearance: No mechanical damage.
Capacitance change: -1.0% ~ +2.0% or 0.5 pF, whichever is greater.
Q value: > 1000.
Insulation resistance: Not less than the initial requirement value. |
Preheat at 150°C ~ 180°C for 1 minute, immerse in solder at 260 ± 5°C for 10 ± 1 seconds, and test after cooling for 24 ± 2 hours. |
| Thermal Shock |
Appearance: No mechanical damage.
Capacitance change: ≤ 0.5% or 0.5 pF, whichever is greater.
Q value: > 2000.
Insulation resistance: ≥ 30% of the initial requirement value.
DWV: Meet the initial requirement value. |
Test in accordance with MIL-STD-202, Method 107, Condition A.
Expose at extreme temperatures for 15 minutes, transition time from minimum to maximum operating temperature ≤ 5 minutes, 5 cycles total. |
| Moisture Resistance |
Appearance: No mechanical damage.
Capacitance change: ≤ 0.5% or 0.5 pF, whichever is greater.
Q value: > 300.
Insulation resistance: ≥ 30% of the initial requirement value.
DWV: Meet the initial requirement value. |
Test in accordance with MIL-STD-202, Method 106. |
| Steady State Humidity Heat |
Appearance: No mechanical damage.
Capacitance change: ≤ 0.3% or 0.3 pF, whichever is greater.
Q value: > 300.
Insulation resistance: Meet the initial requirement value. |
Test in accordance with MIL-STD-202, Method 103, Condition A.
(Apply 1.5V DC voltage at 85°C, 85% RH for 240 hours.) |
| Life (Endurance) |
Appearance: No mechanical damage.
Capacitance change: ≤ 2.0% or 0.5 pF, whichever is greater.
Q value: > 500.
Insulation resistance: ≥ 30% of the initial requirement value. |
Test in accordance with MIL-STD-202, Method 108.
Apply 2× rated voltage at extreme temperature for 2000 hours. |