Mataas na Pagganap ng Single Layer Capacitor

Mataas na Pagganap ng Single Layer Capacitor

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Model No.: Single Layer Capacitor

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High Power RF Microwave Ceramic Capacitor

Single Layer Capacitor

General Type SG	Margin Type SM	Surface Mount Type SS	Array Type SA	Multi-Electrode Type SP

Suitable for RF, microwave, and millimeter-wave applications. Capacitance range: 0.1 ~ 10000 pF	Suitable for RF, microwave, and millimeter-wave applications. Capacitance range: 0.1 ~ 10000 pF	High-precision single-layer series capacitors	An array composed of multiple single-layer capacitors, suitable for multi-channel coupling and bypass applications.	Multi-value, binary-tunable single-layer capacitors, suitable for tuning designs or microwave integrated circuits.

Pamantayan sa pagpapatupad:

GJB2442A-2021 "Pangkalahatang Pagtutukoy para sa Single-Layer Ceramic Dielectric Capacitor na may Mga Antas ng Rate ng Pagkabigo"

Detalyadong detalye:

Q/DLC20015-2019 "Detalyadong Pagtutukoy para sa Single-Layer Ceramic Dielectric Capacitor na may Mga Antas ng Failure Rate"

Mga item sa inspeksyon na itinakda ng pamantayan

Inspection Group	Parameter	Test Method	Test Requirements
A1	Capacitance	GJB2442A-2021 Method 4.5.4	100% inspection
A1	Dissipation Factor (tanδ)	GJB2442A-2021 Method 4.5.5	100% inspection
A1	Insulation Resistance	GJB2442A-2021 Method 4.5.6	100% inspection
A1	Dielectric Withstanding Voltage	GJB2442A-2021 Method 4.5.7	100% inspection
A3	Visual Inspection	GJB2442A-2021 Method 4.5.2	100% inspection
B2	Bond Strength	GJB548C-2021 Method 2011.2	Gold wire diameter 25µm, minimum pull force 5gf
B2	Shear Strength	GJB548C-2021 Method 2019.3	GJB548C-2021 Method 2019.3
B3	Voltage-Temperature Characteristic	GJB2442A-2021 Method 4.5.11	GJB2442A-2021 Requirement 3.14
C1	Immersion	GJB2442A-2021 Method 4.5.12	GJB2442A-2021 Requirement 3.15
C2	Resistance to Soldering Heat	GJB360B-2009 Method 210	GJB2442A-2021 Requirement 3.16
C3	Steady-State Humidity (Low Voltage)	GJB2442A-2021 Method 4.5.14	GJB2442A-2021 Requirement 3.17
C4	Life	GJB2442A-2021 Method 4.5.15	GJB2442A-2021 Requirement 3.18

Application ng Produkto

Ito ay inilalapat sa mga circuit tulad ng paghihiwalay, RF bypass, pagsala, at pagtutugma ng impedance sa mga frequency ng radyo/microwave.
Mga tampok ng produkto

Ang istraktura ay matibay at ang pagganap ay matatag at maaasahan;

Maliit ang sukat, ang pinakamababa ay maaaring umabot sa 10mil x 10mil;

Angkop para sa microwave at millimeter wave application, na may dalas ng aplikasyon hanggang 100GHz;

Proseso ng micro-assembly, na angkop para sa mga paraan ng pag-install tulad ng conductive adhesive bonding, gold-tin eutectic welding, at gold wire bonding.

Numero ng bahagi

1.Single-layer Capacitor Series

General Type SG	Margin Type SM	Surface Mount Type SS

Suitable for RF, microwave, and millimeter-wave applications. Capacitance range: 0.1 ~ 10000 pF	Suitable for RF, microwave, and millimeter-wave applications. Capacitance range: 0.1 ~ 10000 pF	High-precision single-layer series capacitors. The SS single-layer capacitor is equivalent to two single-layer capacitors connected in series.

2. Sukat at Modelo:

Ang una at pangalawang digit ay kumakatawan sa haba, ang pangatlo at ikaapat na digit ay kumakatawan sa lapad, at ang yunit ay mil;

Halimbawa 1010, ang laki ay 10 mils (0.254mm) x 10 mils (0.254mm).

3.Dielectric pare-pareho

Dielectric constant (K) < 10, halimbawa: K9R6 = 9.6, R ay kumakatawan sa decimal point; Dielectric constant (K) ≥ 10, halimbawa: K301 = 300, ang ikatlong digit ay isang kapangyarihan ng 10.
4.Electrode material

Code	Terminal Type	Sputtered Metal Layer		Electroplated Layer
		Material	Thickness (µm)	Material	Thickness (µm)
M	Suitable for Au/Sn and conductive epoxy bonding; not compatible with Sn/Pb soldering.	TiW/Au	0.01 ~ 0.05 / 0.03 ~ 0.05	Au	≥ 2
P	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TiW/Ni/Au	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
T	Suitable for Au/Sn and conductive epoxy bonding; not compatible with Sn/Pb soldering.	TaN/TiW/Au	0.03 ~ 0.10 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
F	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TaN/TiW/Ni/Au	0.03 ~ 0.10 / 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
H	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TaN/TiW/Pt/Au	0.03 ~ 0.10 / 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
D	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TiW/Pt/Au	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
E	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	Ti/Pt/Au	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
X	Suitable for conductive epoxy bonding.	TiW/Ni/Ag	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.10 ~ 0.20	-	-
L	Backside suitable for conductive epoxy bonding.	Front: Ti/Pt/Au Back: Ti/Pt	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2