Single-layer ceramic dielectric capacitor

Single-layer ceramic dielectric capacitor

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Paglalarawan ng Produkto

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Model No.: SA Series

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Paglalarawan ng Produkto

Single Layer Capacitor

SA series array-type single-layer ceramic dielectric capacitor

Application ng Produkto

Inilapat ito sa mga decoupling circuit, RF bypass circuit, DC-blocking circuit, atbp. sa radio frequency/microwave frequency.

Mga tampok ng produkto

Simpleng pag-install, nakakatipid ng espasyo, isinasama sa pakete upang mabawasan ang haba ng lead at mas mababang gastos sa pagpupulong; ang teoretikal na minimum na kabuuang sukat ay 20 mil x 10 mil.
Numero ng bahagi

Single-layer Capacitor Series:

SA Array Type Single-Layer Capacitor

Mga Modelong 2 Dimensional:

Ang 1st at 2nd digit ay kumakatawan sa haba, ang 3rd at 4th digit ay kumakatawan sa lapad, na ang unit ay mil;

Halimbawa 1010, ang laki ay 10 mil (0.254mm) x 10 mil (0.254mm)

3.Dielectric pare-pareho

Dielectric constant (K) < 10, halimbawa: K9R6 = 9.6, kung saan ang R ay kumakatawan sa decimal point; Dielectric constant (K) ≥ 10, halimbawa: K301 = 300, na ang pangatlong digit ay isang kapangyarihan na 10.
4.Electrode material

Code	Terminal Type	Sputtered Metal Layer		Electroplated Layer
		Material	Thickness (µm)	Material	Thickness (µm)
M	Suitable for Au/Sn and conductive epoxy bonding; not compatible with Sn/Pb soldering.	TiW/Au	0.01 ~ 0.05 / 0.03 ~ 0.05	Au	≥ 2
P	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TiW/Ni/Au	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
T	Suitable for Au/Sn and conductive epoxy bonding; not compatible with Sn/Pb soldering.	TaN/TiW/Au	0.03 ~ 0.10 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
F	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TaN/TiW/Ni/Au	0.03 ~ 0.10 / 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
H	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TaN/TiW/Pt/Au	0.03 ~ 0.10 / 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
D	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TiW/Pt/Au	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
E	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	Ti/Pt/Au	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
X	Suitable for conductive epoxy bonding.	TiW/Ni/Ag	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.10 ~ 0.20	-	-
L	Backside suitable for conductive epoxy bonding.	Front: Ti/Pt/Au Back: Ti/Pt	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2